The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Sep. 19, 2011
Applicants:

Hem Takiar, Fremont, CA (US);

Robert C. Miller, San Jose, CA (US);

Warren Middlekauff, San Jose, CA (US);

Michael W. Patterson, Portland, OR (US);

Shrikar Bhagath, San Jose, CA (US);

Inventors:

Hem Takiar, Fremont, CA (US);

Robert C. Miller, San Jose, CA (US);

Warren Middlekauff, San Jose, CA (US);

Michael W. Patterson, Portland, OR (US);

Shrikar Bhagath, San Jose, CA (US);

Assignee:

SanDisk Technologies Inc., Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2010.01); G06K 19/077 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); G11C 5/04 (2006.01); H01L 23/31 (2006.01); H01L 31/0203 (2014.01); H01L 23/29 (2006.01); H01L 23/28 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07745 (2013.01); H01L 2924/1433 (2013.01); H01L 24/48 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/14 (2013.01); H01L 2223/5442 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/01322 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/32145 (2013.01); H05K 3/0052 (2013.01); G06K 19/07732 (2013.01); H01L 2924/15313 (2013.01); H01L 25/16 (2013.01); H01L 21/565 (2013.01); H01L 25/0657 (2013.01); H01L 2924/15312 (2013.01); G11C 5/04 (2013.01); H01L 2223/54473 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/19043 (2013.01); H01L 2223/54433 (2013.01); H01L 23/3107 (2013.01); H01L 2924/15311 (2013.01); H01L 2225/06568 (2013.01); H01L 2224/97 (2013.01); H05K 1/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2223/54486 (2013.01);
Abstract

A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.


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