The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Feb. 29, 2012
Eui-seok Kim, Seoul, KR;
Won-soo Ji, Gyeonggi-do, KR;
Choo-ho Kim, Gyeonggi-do, KR;
Shin-min Rhee, Seoul, KR;
Dong-hun Lee, Chungcheongnam-do, KR;
Hee-young Jun, Gyeonggi-do, KR;
Eui-seok Kim, Seoul, KR;
Won-soo Ji, Gyeonggi-do, KR;
Choo-ho Kim, Gyeonggi-do, KR;
Shin-min Rhee, Seoul, KR;
Dong-hun Lee, Chungcheongnam-do, KR;
Hee-young Jun, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile