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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8852786 B1

PDFFull Text
Date of Patent:
Oct. 07, 2014

Filed:

Dec. 22, 2010

Ceramic-metal sealing structure, and associated method

Applicants:

Scott Andrew Weaver, Ballston Lake, NY (US);

Don Mark Lipkin, Niskayuna, NY (US);

Radhakrishna Badekila Bhat, Niskayuna, NY (US);

Andrew Joseph Detor, Albany, NY (US);

Brian William Cerniglia, Waterford, NY (US);

Inventors:

Scott Andrew Weaver, Ballston Lake, NY (US);

Don Mark Lipkin, Niskayuna, NY (US);

Radhakrishna Badekila Bhat, Niskayuna, NY (US);

Andrew Joseph Detor, Albany, NY (US);

Brian William Cerniglia, Waterford, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:

Francis T. Coppa

Primary Examiner:

Basia Ridley

Assistant Examiner:

Caitlin Wilmot

Int. Cl.
CPC ...
H01M 2/08 (2006.01); B23K 35/20 (2006.01); C04B 35/645 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); C04B 37/02 (2006.01); H01M 10/04 (2006.01); B23K 1/00 (2006.01); B23K 20/233 (2006.01); H01M 10/39 (2006.01); H01M 4/38 (2006.01); H01M 4/58 (2010.01);
U.S. Cl.
CPC ...
B23K 20/023 (2013.01); C04B 2237/52 (2013.01); B23K 2201/38 (2013.01); C04B 2237/127 (2013.01); H01M 4/381 (2013.01); C04B 35/645 (2013.01); C04B 2235/963 (2013.01); B23K 20/16 (2013.01); C04B 2237/123 (2013.01); H01M 2/08 (2013.01); C04B 2237/525 (2013.01); C04B 2237/708 (2013.01); C04B 2237/405 (2013.01); C04B 37/026 (2013.01); B23K 2203/18 (2013.01); Y02E 60/12 (2013.01); H01M 10/04 (2013.01); B23K 1/0008 (2013.01); B23K 2203/08 (2013.01); C04B 2237/122 (2013.01); B23K 20/233 (2013.01); C04B 2237/12 (2013.01); H01M 10/39 (2013.01); H01M 4/582 (2013.01); C04B 2237/72 (2013.01);
Abstract

A method of sealing a ceramic component to a metal component for a metal halide battery is provided. The method involves the steps of coating a portion of the ceramic component with a metallic coating, and then bonding the coated ceramic component to the metal component. The metallic coating includes a reactive metal. A sealing structure formed by using such a method is also presented.

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