The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Feb. 27, 2009
Applicants:

Ashish M. Sukhadia, Bartlesville, OK (US);

Max P. Mcdaniel, Bartlesville, OK (US);

Ted Cymbaluk, Kemah, TX (US);

Rajendra K. Krishnaswamy, Lexington, MA (US);

Lawrence Szmutko, Orange, TX (US);

Inventors:

Ashish M. Sukhadia, Bartlesville, OK (US);

Max P. McDaniel, Bartlesville, OK (US);

Ted Cymbaluk, Kemah, TX (US);

Rajendra K. Krishnaswamy, Lexington, MA (US);

Lawrence Szmutko, Orange, TX (US);

Assignee:

Chevron Phillips Chemical Company LP, The Woodlands, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08F 210/00 (2006.01); C08F 110/02 (2006.01); B32B 27/08 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08F 110/02 (2013.01); C08J 5/18 (2013.01); C08J 2323/04 (2013.01);
Abstract

A polymeric resin having a density of greater than about 0.960 g/cc, a melt index of from about 1.3 g/10 min. to about 2.8 g/10 min., a zero shear viscosity of from about 1×10Pa*s to about 1×10Pa*s, a recoverable shear parameter of from about 220 to about 370, and a CY-a parameter of from about 0.155 to about 0.200. A polymeric resin having an initial tension defined by the equation IT≧−1.67*(MI)+b where b is 5.17 and a percent decrease in the extrusion pressure of the resin of about 30% when compared to polymer resin of similar melt index prepared with a catalyst that has not undergone an activation comprising an oxidation, reduction, oxidation sequence wherein the resin when formed into a film has a moisture vapor transmission rate of from about 0.21 g.mil/100 in/day to about 0.33 g.mil/100 in/day.


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