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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8852734 B1

PDFFull Text
Date of Patent:
Oct. 07, 2014

Filed:

Oct. 12, 2010

Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

Applicants:

Nobuki Tanaka, Tokyo, JP;

Seiji Mori, Tokyo, JP;

Inventors:

Nobuki Tanaka, Tokyo, JP;

Seiji Mori, Tokyo, JP;

Assignee:

Sumitomo Bakelite Company, Ltd., Tokyo, JP;

Attorney:

Ditthavong & Steiner, P.C.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); C08K 3/36 (2006.01); C08G 59/32 (2006.01); C08L 63/00 (2006.01); C08L 63/04 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08J 2363/00 (2013.01); C08G 59/4014 (2013.01); H05K 2201/0257 (2013.01); C08K 2201/011 (2013.01); C08G 59/621 (2013.01); C08K 2201/003 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); H05K 2201/0209 (2013.01); C08J 5/24 (2013.01); H05K 2201/0266 (2013.01); Y10S 428/901 (2013.01);
Abstract

The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less.

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