The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Aug. 27, 2012
Applicants:

Kamlesh P. Nair, Florence, KY (US);

Steven D. Gray, Mequon, WI (US);

Camilo Cano, Union, KY (US);

Inventors:

Kamlesh P. Nair, Florence, KY (US);

Steven D. Gray, Mequon, WI (US);

Camilo Cano, Union, KY (US);

Assignee:

Ticona LLC, Florence, KY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 19/38 (2006.01); B29C 43/24 (2006.01); C09K 19/48 (2006.01); C09K 19/32 (2006.01); C09K 19/34 (2006.01); C09K 19/30 (2006.01); C09K 19/22 (2006.01); C08K 5/20 (2006.01); C09K 19/04 (2006.01);
U.S. Cl.
CPC ...
C09K 19/22 (2013.01); C09K 2019/0481 (2013.01); C09K 19/48 (2013.01); C09K 19/322 (2013.01); C09K 19/3444 (2013.01); C09K 19/3086 (2013.01); C08K 5/20 (2013.01);
Abstract

A melt-extruded substrate that can be readily thermoformed into a shaped, three-dimensional article is provided. The substrate is formed from a polymer composition that contains a thermotropic liquid crystalline polymer and a unique aromatic amide oligomer. The present inventors have discovered that the oligomer can help increase the 'low shear' complex viscosity of the resulting polymer. The ability to achieve enhanced low shear viscosity values can lead to polymer compositions with an increased melt strength, which allows the resulting substrate to better maintain its shape during thermoforming without exhibiting a substantial amount of sag. Due to its relatively high degree of melt strength, the polymer composition is particularly well suited for forming thin extruded substrates for use in thermoforming processes.


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