The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Jul. 17, 2009
Applicants:

Lars Wittenbecher, Duesseldorf, DE;

Michael Henningsen, Frankenthal, DE;

Gregor Daun, Neckargemuend, DE;

Dieter Flick, Boehl-Iggelheim, DE;

Joerg-peter Geisler, Bingen, DE;

Juergen Schillgalies, Moers, DE;

Erhard Jacobi, Huenstetten, DE;

Inventors:

Lars Wittenbecher, Duesseldorf, DE;

Michael Henningsen, Frankenthal, DE;

Gregor Daun, Neckargemuend, DE;

Dieter Flick, Boehl-Iggelheim, DE;

Joerg-Peter Geisler, Bingen, DE;

Juergen Schillgalies, Moers, DE;

Erhard Jacobi, Huenstetten, DE;

Assignee:

BASF SE, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/00 (2006.01); C07C 279/04 (2006.01); C07C 279/16 (2006.01);
U.S. Cl.
CPC ...
C07C 279/04 (2013.01); C07C 279/16 (2013.01);
Abstract

The present invention provides a process for producing moldings, the curing of the mold being carried out using a blend comprising one or more epoxy resins and a mixture, the curing component a) being used within the mixture in the range from 0.3 to 0.9 amine equivalent per equivalent of epoxide of the epoxy resin used, and the hardener component b) being a compound of the formula I.


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