The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Jun. 21, 2010
Applicants:

Jeremy W. Mccutcheon, Rolla, MO (US);

Robert D. Brown, Rolla, MO (US);

Inventors:

Jeremy W. McCutcheon, Rolla, MO (US);

Robert D. Brown, Rolla, MO (US);

Assignee:

Brewer Science Inc., Rolla, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/683 (2006.01); H01L 21/18 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68386 (2013.01); H01L 2221/68381 (2013.01); H01L 21/68721 (2013.01); H01L 21/67092 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01);
Abstract

New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.


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