The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Oct. 24, 2011
Narutoshi Murasugi, Matsudo, JP;
Kazunori Maekawa, Matsudo, JP;
Zenzo Ishijima, Matsudo, JP;
Hitachi Powdered Metals Co., Ltd., Matsudo, JP;
Abstract
A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with a cavity, a storage portion for storing a raw material with a metal powder and a binder having plasticity, and a punch hole that connects the cavity and the storage portion so as to form a gate therebetween. The plunger is formed so as to be slidably inserted into the storage portion and to fill the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger in the sliding direction of the plunger and opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.