The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Mar. 06, 2012
Applicants:

Hiroshige Owaki, Okaya, JP;

Haruhisa Uezawa, Shiojiri, JP;

Inventors:

Hiroshige Owaki, Okaya, JP;

Haruhisa Uezawa, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 29/393 (2006.01); B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 2/055 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14233 (2013.01); B41J 2/055 (2013.01); B41J 2/04563 (2013.01); B41J 2/04581 (2013.01); B41J 2202/14241 (2013.01);
Abstract

A liquid ejection head includes a nozzle plate on which nozzle openings for ejecting liquid are provided, a flow path formation substrate on which pressure generation chambers communicating with the nozzle openings are provided, communicating portions in which the liquid to be supplied to the pressure generation chambers is stored, and piezoelectric elements which generate pressure change in the liquid in the pressure generation chambers. In the liquid ejection head, a thermistor is arranged on a surface of the flow path formation substrate at an opposite side to the nozzle openings and one lead wiring of the thermistor is connected to wiring layers which are formed on the surface of the flow path formation substrate in a state where one side ends of the wiring layers face to the communicating portions.


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