The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Apr. 19, 2012
Applicant:
Ken Kitamoto, Saitama, JP;
Inventor:
Ken Kitamoto, Saitama, JP;
Assignee:
Enplas Corporation, Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/00 (2006.01); B01L 7/00 (2006.01); G01N 27/447 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/44791 (2013.01); B01L 7/525 (2013.01); B01L 2300/1805 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/0816 (2013.01); B01L 3/502715 (2013.01); B01L 3/502707 (2013.01); B01L 2400/0421 (2013.01);
Abstract
Chip bodyin which a through hole or concave is formed, intermediate film, on one surface of which adhesive layer' is formed and lower film, on one surface of which transfer function layeris formed, are prepared. Intermediate filmand lower filmare bonded together such that transfer function layeris embedded in adhesive layer′ to form a laminated body. The laminated body and chip bodyare bonded together by thermocompression to manufacture micro-chip