The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Nov. 10, 2010
Applicants:

Claude Drevon, Toulouse, FR;

Olivier Vendier, Lacroix-Falgarde, FR;

Walim Ben Naceur, Bordeaux, FR;

Inventors:

Claude Drevon, Toulouse, FR;

Olivier Vendier, Lacroix-Falgarde, FR;

Walim Ben Naceur, Bordeaux, FR;

Assignee:

Thales, Neuilly sur Seine, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01322 (2013.01); H01L 2224/73265 (2013.01); H01L 23/10 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/15192 (2013.01); H01L 2224/48227 (2013.01);
Abstract

A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×10Pa.


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