The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Jul. 05, 2012
Applicant:

Chi-jung Wu, New Taipei, TW;

Inventor:

Chi-Jung Wu, New Taipei, TW;

Assignee:

Getac Technology Corporation, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/00 (2006.01); H01L 23/427 (2006.01); G06F 9/44 (2006.01);
U.S. Cl.
CPC ...
G06F 9/4401 (2013.01); H01L 23/427 (2013.01);
Abstract

A speed-up booting module of an electronic device includes a first heat pipe with two ends connected to a first component and a second component respectively, and the first heat pipe including a first working fluid, wherein when a booting process is performed at a first environmental temperature, the heat from the first component in operation is transferred to the second component so that a temperature of the second component reaches an operating temperature; and a second heat pipe with two ends connected to the first component and a third component respectively, and the second heat pipe including a second working fluid, a boiling point of the second working fluid is higher than the boiling point of the first working fluid; wherein at a second environmental temperature, a temperature of the second component reaches the boiling point, the heat from the first component is transferred to the second component.


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