The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Mar. 06, 2014
Taiyo Yuden Co., Ltd., Tokyo, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate one or both mounting areas of the system section and power circuit section and the mounting area of the first high-frequency processing section. The circuit substrate includes a core layer that is a conductive layer thicker than the other conductive layers and that functions as a ground. Electronic components are arranged in through-holes formed in the core layer.