The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Oct. 13, 2011
Applicants:

Naofumi Kitano, Osaka, JP;

Toshiro Nishimura, Osaka, JP;

Inventors:

Naofumi Kitano, Osaka, JP;

Toshiro Nishimura, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/0979 (2013.01); H05K 1/113 (2013.01);
Abstract

In order to keep impedance characteristics to desired values across the entire operating frequency band, an electronic circuit of the present invention includes an integrated circuit, a decoupling capacitor, and a multilayer circuit board on which the integrated circuit and the decoupling capacitor are mounted. In the electronic circuit, a planar land is formed on one or both of a power layer and a ground layer of the multilayer circuit board, the land having densely disposed therein a plurality of via holes that connect a terminal of the integrated circuit and a corresponding terminal of the decoupling capacitor, and the land formed on the power layer or the ground layer is discontinuously disposed at a predetermined interval with a gap having a predetermined width provided therebetween.


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