The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Feb. 14, 2012
Applicant:
Georg Borghoff, Warstein, DE;
Inventor:
Georg Borghoff, Warstein, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 25/07 (2006.01); H01L 21/50 (2006.01); H01R 4/50 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 2224/4846 (2013.01); H01L 2924/13055 (2013.01); H01L 2224/32225 (2013.01); H01L 21/50 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/3011 (2013.01); H01R 4/5091 (2013.01); H01L 2924/13091 (2013.01); H01L 23/10 (2013.01);
Abstract
A power semiconductor module includes an electrically conductive connecting element, an accommodating region, and a clamping element which can be brought from a first position into a second position. If the clamping element is situated in the first position, a connecting region of a module-external connecting conductor can be inserted into the accommodating region and be clamped to the power semiconductor module with the formation of an electrically conductive connection between the connection region and the connecting element. For this purpose, the clamping element is brought from the first position into the second position.