The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Dec. 21, 2012
Applicant:
Canon Components, Inc., Saitama, JP;
Inventor:
Junya Kinoshita, Saitama, JP;
Assignee:
Canon Components, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/12 (2006.01); H04N 1/193 (2006.01); H04N 1/192 (2006.01); H04N 1/028 (2006.01);
U.S. Cl.
CPC ...
H04N 1/02815 (2013.01); H04N 1/1932 (2013.01); H04N 1/1938 (2013.01); H04N 1/192 (2013.01); H04N 1/1935 (2013.01); H04N 1/1934 (2013.01); H04N 1/193 (2013.01); H04N 1/1931 (2013.01); H04N 1/1933 (2013.01);
Abstract
A sensor substrate unit is formed by connecting edges of a plurality of sensor substrates in a longitudinal direction. Sensor chips at the edges are mounted beyond the edges. The edges include convex portions and convex portions for connecting the sensor substrates. Farthest tips of the sensor chips are positioned inside of farthest edges of the convex portions and inside of farthest edges of the convex portions in the longitudinal direction.