The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Nov. 12, 2009
Applicants:

Alexander Cooper, Belmont, CA (US);

Alton H. Phillips, East Palo Alto, CA (US);

Scott Coakley, Belmont, CA (US);

Inventors:

Alexander Cooper, Belmont, CA (US);

Alton H. Phillips, East Palo Alto, CA (US);

Scott Coakley, Belmont, CA (US);

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/30 (2006.01); H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/22 (2006.01); H01F 5/06 (2006.01); H01F 41/06 (2006.01);
U.S. Cl.
CPC ...
H01F 5/06 (2013.01); H01F 27/22 (2013.01); H01F 41/0658 (2013.01);
Abstract

Embodiments of the invention provide improved thermal conductivity within, among other things, electromagnetic coils, coil assemblies, electric motors, and lithography devices. In one embodiment, a thermally conductive coil includes at least two adjacent coil layers. The coil layers include windings of wires formed from a conductor and an insulator that electrically insulates the windings within each coil layer. In some cases the insulator of the wires is at least partially absent along an outer surface of one or both coil layers to increase the thermal conductivity between the coil layers. In some embodiments, an insulation layer is provided between the coil layers to electrically insulate the coil layers. In some cases the insulation layer has a thermal conductivity greater than the thermal conductivity of the wire insulator.


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