The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Nov. 30, 2010
Applicants:
James Leroy Blair, San Diego, CA (US);
Jeffrey Thomas Smith, San Diego, CA (US);
Inventors:
James Leroy Blair, San Diego, CA (US);
Jeffrey Thomas Smith, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 3/00 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H01P 3/08 (2013.01); H05K 1/0245 (2013.01); H01P 3/00 (2013.01); H05K 1/0219 (2013.01); H05K 1/0237 (2013.01); H05K 1/0393 (2013.01); H05K 1/147 (2013.01); H05K 3/222 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.