The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Mar. 27, 2012
Applicants:

Joachim Mahler, Regensburg, DE;

Ralf Wombacher, Burglengenfeld, DE;

Anton Prueckl, Schierling, DE;

Inventors:

Joachim Mahler, Regensburg, DE;

Ralf Wombacher, Burglengenfeld, DE;

Anton Prueckl, Schierling, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chip arrangement is provided, the chip arrangement including: a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip disposed over the first chip carrier and electrically insulated from the first chip carrier; and a third chip electrically connected to the second chip carrier; wherein at least one of the first chip and the second chip is electrically connected to the third chip.


Find Patent Forward Citations

Mahler, Joachim. (2014). Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package (U.S. Patent No. 8847385). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8847385

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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