The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Dec. 19, 2011
Yoshiaki Ueda, Higashiomi, JP;
Shinji Nakamoto, Higashiomi, JP;
Hiroshi Mizushima, Higashiomi, JP;
Nobuyuki Tanaka, Higashiomi, JP;
Yoshiaki Ueda, Higashiomi, JP;
Shinji Nakamoto, Higashiomi, JP;
Hiroshi Mizushima, Higashiomi, JP;
Nobuyuki Tanaka, Higashiomi, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.