The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Feb. 04, 2013
Takayuki Otsuka, Tokyo, JP;
Fujio Furukawa, Tokyo, JP;
Ryuichi Wada, Tokyo, JP;
Makoto Kitazume, Tokyo, JP;
Toshiki Komiyama, Tokyo, JP;
Takayuki Otsuka, Tokyo, JP;
Fujio Furukawa, Tokyo, JP;
Ryuichi Wada, Tokyo, JP;
Makoto Kitazume, Tokyo, JP;
Toshiki Komiyama, Tokyo, JP;
Mitsumi Electric Co., Ltd., Tokyo, JP;
Abstract
An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.