The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Dec. 07, 2011
Applicants:

Kenichi Saita, Komaki, JP;

Shinya Miyamoto, Kohnan, JP;

Daisuke Yamashita, Komaki, JP;

Shinya Suzuki, Kasugai, JP;

Hirohito Hashimoto, Komaki, JP;

Inventors:

Kenichi Saita, Komaki, JP;

Shinya Miyamoto, Kohnan, JP;

Daisuke Yamashita, Komaki, JP;

Shinya Suzuki, Kasugai, JP;

Hirohito Hashimoto, Komaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H01L 49/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H05K 3/4602 (2013.01); H05K 1/186 (2013.01); H05K 1/0271 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/10015 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.


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