The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Nov. 28, 2012
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Piet Wessels, Nijmegen, NL;

Nico Berckmans, Wijchen, NL;

Khin Hoong Lim, Singapore, SG;

Michael John Ben Bolt, Arnhem, NL;

Jerome Guillaume Anna Dubois, Singapore, SG;

Naveen Agrawal, Rajasthan, IN;

Gaurav Singh Bisht, Pasir ris, SG;

Jayaraj Thillaigovindan, Tamilnadu, IN;

Jie Liao, Boise, ID (US);

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/76283 (2013.01); H01L 29/0649 (2013.01);
Abstract

Disclosed is an integrated circuit die comprising an active substrate including a plurality of components laterally separated from each other by respective isolation structures, at least some of the isolation structures carrying a further component, wherein the respective portions of the active substrate underneath the isolation structures carrying said further components are electrically insulated from said components. A method of manufacturing such an IC die is also disclosed.


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