The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Mar. 29, 2010
Applicants:

Hitoshi Murata, Toyama, JP;

Tetsuya Kosugi, Toyama, JP;

Shinobu Sugiura, Imizu, JP;

Inventors:

Hitoshi Murata, Toyama, JP;

Tetsuya Kosugi, Toyama, JP;

Shinobu Sugiura, Imizu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a heating device, a substrate processing apparatus, and a method of manufacturing a semiconductor device, which can suppress differences between heating bodies, and simultaneously, can suppress shearing of a holder due to thermal deformation of the heating element. The heating device comprises: a heating element including a mountain part and a valley part that are alternately connected in plurality in a meander shape with both ends being fixed; holding body receiving parts respectively installed at ends of the valley parts and formed as cutout parts having a width larger than a width of the valley part; an insulating body installed at an outer circumference of the heating element; and a holding body disposed in the holding body receiving part and fixed to the insulating body.


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