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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8846799 B1

PDFFull Text
Date of Patent:
Sep. 30, 2014

Filed:

Jul. 29, 2008

Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring board

Applicants:

Hiroyuki Fujisawa, Koriyama, JP;

Hiroki Tamiya, Koriyama, JP;

Inventors:

Hiroyuki Fujisawa, Koriyama, JP;

Hiroki Tamiya, Koriyama, JP;

Assignee:

Panasonic Corporation, Kadoma-shi, JP;

Attorneys:

Edwards Wildman Palmer LLP

James E. Armstrong, IV, Esq.

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Bijan Ahvazi

Assistant Examiner:

Lanee Reuther

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); C08G 59/38 (2006.01); B32B 27/38 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); B32B 27/04 (2006.01); C08G 59/62 (2006.01); B32B 15/08 (2006.01); B32B 27/12 (2006.01); C08K 5/13 (2006.01); H05K 3/46 (2006.01); C08K 3/36 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08K 5/13 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0239 (2013.01); C08G 59/38 (2013.01); B32B 27/38 (2013.01); H05K 3/4626 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); B32B 27/04 (2013.01); C08G 59/621 (2013.01); B32B 15/08 (2013.01); C08J 2363/08 (2013.01); B32B 27/12 (2013.01); C08K 3/22 (2013.01);
Abstract

The present invention provides an epoxy resin composition exhibiting good workability in drilling, molding, and desmearing as well as good interlayer adhesion strength. This epoxy resin composition comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin is composed of a dicyclopentadiene-based epoxy resin and a novolac-based epoxy resin. The curing agent is a biphenyl-based phenol resin. The inorganic filler is composed of aluminum hydroxide and granular silica having an epoxy-silane treated surface. The epoxy resin composition contains 20 to 50% by weight of the granular silica. The epoxy resin composition contains 2 to 15% by weight, based on total weight of granular silica, of the aluminum hydroxide.

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