The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Jun. 01, 2011
Applicants:
Jun-ying Zhang, Woodbury, MN (US);
Michael A. Haase, St. Paul, MN (US);
Todd A. Ballen, St. Paul, MN (US);
Terry L. Smith, Roseville, MN (US);
Inventors:
Jun-Ying Zhang, Woodbury, MN (US);
Michael A. Haase, St. Paul, MN (US);
Todd A. Ballen, St. Paul, MN (US);
Terry L. Smith, Roseville, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/311 (2006.01); C23C 16/34 (2006.01); H01L 21/306 (2006.01); H01L 33/46 (2010.01); C23C 16/02 (2006.01); B82Y 20/00 (2011.01); C23C 14/02 (2006.01); H01L 21/46 (2006.01); C23C 14/06 (2006.01); H01S 5/347 (2006.01); G02B 6/44 (2006.01); H01S 5/183 (2006.01); H01L 33/28 (2010.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); H01S 5/347 (2013.01); C23C 16/345 (2013.01); H01L 33/46 (2013.01); G02B 6/4439 (2013.01); C23C 16/0227 (2013.01); B82Y 20/00 (2013.01); C23C 14/021 (2013.01); H01S 5/18369 (2013.01); H01L 21/46 (2013.01); H01L 33/28 (2013.01); C23C 14/0652 (2013.01);
Abstract
A multilayer construction is disclosed. The multilayer construction includes a -II-VI semiconductor layer ()x and a SiNlayer () disposed directly on the II-VI semiconductor layer. To improve the adhesion of the Si3N4 layer () a native oxide on the II-VI semiconductor layer is removed.