The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Dec. 13, 2010
Applicants:
David Lysacek, Zasova, CZ;
Jana Vojtechovska, Roznov Pod Radhostem, CZ;
Lubomir Dornak, Roznov Pod Radhostem, CZ;
Petr Kostelnik, Frenstat Pod Radhostem, CZ;
Lukas Valek, Stritez Nad Becvou, CZ;
Petr Panek, Zasova, CZ;
Inventors:
David Lysacek, Zasova, CZ;
Jana Vojtechovska, Roznov Pod Radhostem, CZ;
Lubomir Dornak, Roznov Pod Radhostem, CZ;
Petr Kostelnik, Frenstat Pod Radhostem, CZ;
Lukas Valek, Stritez Nad Becvou, CZ;
Petr Panek, Zasova, CZ;
Assignee:
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/322 (2006.01); H01L 29/66 (2006.01); H01L 33/16 (2010.01);
U.S. Cl.
CPC ...
H01L 21/3221 (2013.01); H01L 29/66272 (2013.01);
Abstract
At least one exemplary embodiment is directed to a method of forming a multilayered gettering structure that can be used to control wafer warpage.