The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Feb. 28, 2012
Applicant:
Hong-gu Yi, Gyeonggi-do, KR;
Inventor:
Hong-Gu Yi, Gyeonggi-do, KR;
Assignee:
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/44 (2006.01); H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 27/10855 (2013.01); H01L 27/10876 (2013.01);
Abstract
A method for fabricating a semiconductor device includes providing a substrate including first landing plugs and second landing plugs that are arrayed on a first line, forming a capping layer over the substrate, forming hole-type first trenches that expose the second landing plugs by selectively etching the capping layer, forming an insulation layer over the substrate including the first trenches, forming line-type second trenches that are stretched on the first line while overlapping with the first trenches by selectively etching the insulation layer, and forming a first conductive layer inside the second trenches.