The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Feb. 06, 2012
Applicants:

Kentaro Suzuki, Kawasaki, JP;

Takehito Okabe, Atsugi, JP;

Hiroaki Sano, Machida, JP;

Junji Iwata, Yokohama, JP;

Inventors:

Kentaro Suzuki, Kawasaki, JP;

Takehito Okabe, Atsugi, JP;

Hiroaki Sano, Machida, JP;

Junji Iwata, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); H01L 27/14685 (2013.01); H01L 27/14623 (2013.01); H01L 27/14621 (2013.01);
Abstract

An interlayer insulating film is disposed above an image pickup region and a peripheral region of the semiconductor substrate. An opening is formed in the interlayer insulating film at a position overlying a photoelectric conversion portion. A waveguide member is formed above the image pickup region and the peripheral region of the semiconductor substrate. A part of the waveguide member, which part is disposed above the peripheral region, is removed such that the interlayer insulating film is exposed.


Find Patent Forward Citations

Suzuki, Kentaro. (2014). Semiconductor device manufacturing method for forming an opening to provide a plug (U.S. Patent No. 8846436). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8846436

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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