The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Dec. 24, 2008
Applicants:

Takuji Okahisa, Itami, JP;

Seiji Nakahata, Itami, JP;

Tomoki Uemura, Itami, JP;

Inventors:

Takuji Okahisa, Itami, JP;

Seiji Nakahata, Itami, JP;

Tomoki Uemura, Itami, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01B 21/06 (2006.01); C01C 1/02 (2006.01); C30B 23/00 (2006.01); C30B 25/00 (2006.01); C30B 28/12 (2006.01); C30B 29/40 (2006.01); C30B 33/12 (2006.01); C30B 25/02 (2006.01);
U.S. Cl.
CPC ...
C30B 29/403 (2013.01); C30B 29/406 (2013.01); C30B 33/12 (2013.01); C30B 25/02 (2013.01);
Abstract

Affords Group-III nitride single-crystal ingots and III-nitride single-crystal substrates manufactured utilizing the ingots, as well as methods of manufacturing III-nitride single-crystal ingots and methods of manufacturing III-nitride single-crystal substrates, wherein the incidence of cracking during length-extending growth is reduced. Characterized by including a step of etching the edge surface of a base substrate, and a step of epitaxially growing onto the base substrate hexagonal-system III-nitride monocrystal having crystallographic planes on its side surfaces. In order to reduce occurrences of cracking during length-extending growth of the ingot, depositing-out of polycrystal and out-of-plane oriented crystal onto the periphery of the monocrystal must be controlled. A layer of the base substrate edge surface, as just described, where it has been mechanically altered is removed beforehand by etching, whereby crystallographic planes form on the side surfaces of the III-nitride single-crystal ingot that is formed onto the base substrate, which therefore controls depositing-out of polycrystal and out-of-plane oriented crystal and reduces occurrences of cracking.


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