The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Dec. 08, 2011
Applicant:
Hiroyuki Kumakura, Tochigi, JP;
Inventor:
Hiroyuki Kumakura, Tochigi, JP;
Assignee:
Dexerials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 37/00 (2006.01); H01B 1/02 (2006.01); H01B 1/22 (2006.01); H01R 4/04 (2006.01); C09J 9/02 (2006.01); H05K 3/32 (2006.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01); C08G 59/50 (2006.01); C08K 7/06 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); H01R 4/04 (2013.01); H01L 2924/01023 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/19041 (2013.01); C09J 9/02 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/0665 (2013.01); C08K 7/06 (2013.01); C09J 11/04 (2013.01); H01L 2224/29499 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01009 (2013.01); H01L 2924/01006 (2013.01); H01B 1/22 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01027 (2013.01); C09J 163/00 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/29355 (2013.01); H01L 2924/01029 (2013.01); H01L 27/29 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/01079 (2013.01); H01L 24/83 (2013.01); H01L 2924/14 (2013.01); C08K 3/08 (2013.01); C08G 59/5073 (2013.01); H05K 2201/0245 (2013.01);
Abstract
An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50, is used as the conductive particles, the minor axis of the metal flake power being, in a length, 10 to 50% of the major axis. The amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.