The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Oct. 20, 2011
Applicant:
Takashi Iseki, Tokyo, JP;
Inventor:
Takashi Iseki, Tokyo, JP;
Assignee:
Sumitomo Metal Mining Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 18/00 (2006.01); C22C 18/04 (2006.01); B23K 35/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/282 (2013.01); C22C 18/04 (2013.01); H05K 3/3463 (2013.01);
Abstract
There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400° C. and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass %, preferably 3.0 to 7.0 mass % of Al, 0.002 to 0.800 mass %, preferably 0.005 to 0.500 mass % of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass % of Mg or 0.3 to 3.0 mass % of Ge.