The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Jul. 29, 2013
Applicant:

Pulse Electronics, Inc., San Diego, CA (US);

Inventors:

Aurelio J. Gutierrez, Bonita, CA (US);

Russell L. Machado, San Diego, CA (US);

Christopher P. Schaffer, Fallbrook, CA (US);

Victor H. Renteria, Poway, CA (US);

Assignee:

Pulse Electronics, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/66 (2006.01); H05K 7/10 (2006.01); H01F 27/02 (2006.01); H02M 1/12 (2006.01); H05K 3/30 (2006.01); H01F 27/26 (2006.01); H01F 17/06 (2006.01); H01F 38/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/10 (2013.01); H01F 27/263 (2013.01); H01F 27/027 (2013.01); H02M 1/126 (2013.01); H01F 17/062 (2013.01); H01F 27/02 (2013.01); H05K 3/303 (2013.01); H01F 2038/006 (2013.01);
Abstract

A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.


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