The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Mar. 11, 2009
Charles C. Byers, Wheaton, IL (US);
William H. Scofield, Batavia, IL (US);
Charles C. Byers, Wheaton, IL (US);
William H. Scofield, Batavia, IL (US);
Alcatel Lucent, Boulogne-Billancourt, FR;
Abstract
Apparatus including cooling manifold, having metal cooling body and metal cooling block. Metal cooling body has internal passageway. Metal cooling block extends away from metal cooling body. Metal cooling block has surface oriented for being placed adjacent to and in substantially direct thermal communication with an electronic component located at distance away from metal cooling body. Cooling manifold is configured for circulating a working fluid through internal passageway and for precluding passage of the working fluid from metal cooling body into metal cooling block. Method that includes providing electronic component and cooling manifold. Provided cooling manifold includes metal cooling body and metal cooling block; metal cooling body has internal passageway; metal cooling block extends away from metal cooling body; metal cooling block has surface oriented adjacent to and in substantially direct thermal communication with electronic component being located at distance away from metal cooling body. Method also includes causing working fluid to be circulated through internal passageway while precluding passage of working fluid from metal cooling body into metal cooling block, such that heat is transferred from electronic component to working fluid.