The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Jun. 21, 2012
Applicant:

Christian Lillelund, Fredensborg, DK;

Inventor:

Christian Lillelund, Fredensborg, DK;

Assignee:

Invensense, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 11/04 (2006.01); H04R 17/02 (2006.01); H04R 19/04 (2006.01); H04R 21/02 (2006.01); H04R 1/00 (2006.01); H04R 9/06 (2006.01); H04R 11/02 (2006.01); H04R 1/04 (2006.01); H04R 19/01 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); H04R 19/016 (2013.01); H04R 2201/029 (2013.01);
Abstract

The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure. The sidewall structure may therefore be utilized to provide electrical connectivity from the conductive microphone diaphragm and from the backplate to a microphone preamplifier arranged on the carrier.


Find Patent Forward Citations

Loading…