The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Jul. 27, 2010
Applicants:

Yasuhiro Nagatomo, Kawasaki, JP;

Takeshi Kawashima, Tokyo, JP;

Katsuyuki Hoshino, Tokyo, JP;

Shoichi Kawashima, Kawasaki, JP;

Inventors:

Yasuhiro Nagatomo, Kawasaki, JP;

Takeshi Kawashima, Tokyo, JP;

Katsuyuki Hoshino, Tokyo, JP;

Shoichi Kawashima, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/08 (2006.01); H01L 21/02 (2006.01); H01S 5/20 (2006.01); H01S 5/12 (2006.01); H01S 5/323 (2006.01); H01S 5/10 (2006.01);
U.S. Cl.
CPC ...
H01S 5/1228 (2013.01); H01S 5/2059 (2013.01); H01S 5/1231 (2013.01); H01S 5/32341 (2013.01); H01S 5/1017 (2013.01); H01L 21/02579 (2013.01); H01S 5/2095 (2013.01); H01L 21/0254 (2013.01); H01L 21/02538 (2013.01); H01L 21/02667 (2013.01); H01L 21/02389 (2013.01);
Abstract

There are provided a process for producing a semiconductor device and a semiconductor device which allow conductivity distribution to be formed without making refractive index distributed even in a material system of a semiconductor difficult to be subjected to ion implantation. The process for producing a semiconductor device includes the steps of forming a semiconductor layer containing a dopant; forming a concave and convex structure on the semiconductor layer by partially removing the semiconductor layer; and forming a conductivity distribution reflecting the concave and convex structure in the semiconductor layer by performing heat treatment on the semiconductor layer in which the concave and convex structure has been formed at a temperature at which a material forming the semiconductor layer causes mass transport and filling up a hole of a concave portion of the concave and convex structure with the material forming the semiconductor layer.


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