The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Dec. 11, 2013
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Lei Bai, Shenzhen, CN;

Xiongbiao Liu, Shenzhen, CN;

Lexiong Peng, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 12/737 (2013.01);
Abstract

The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.


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