The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Jul. 22, 2011
Eunyoung Seok, Plano, TX (US);
Brian P. Ginsburg, Allen, TX (US);
Baher Haroun, Allen, TX (US);
Srinath Ramaswamy, Murphy, TX (US);
Vijay B. Rentala, Plano, TX (US);
Eunyoung Seok, Plano, TX (US);
Brian P. Ginsburg, Allen, TX (US);
Baher Haroun, Allen, TX (US);
Srinath Ramaswamy, Murphy, TX (US);
Vijay B. Rentala, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A loop antenna is provided. The apparatus comprises a substrate, a first metallization layer, and a second metallization layer. The substrate has first and second feed terminals and a ground terminal. The first metallization layer is disposed over the substrate and includes a first window conductive region, a first conductive region, a second conductive region, and a third conductive region. The first conductive region is disposed over and is in electrical contact with the first feed terminal; it is also is substantially circular and located within the first window region. The second conductive region is disposed over and is in electrical contact with the second feed terminal; it is also substantially circular and is located within the first window region. The a third conductive region is disposed over and is in electrical contact with the ground terminal, and the third conductive region substantially surrounds the first window region. The second metallization layer is disposed over and is in electrical contact with the first, second, and third conductive regions of the first metallization layer, and the second metallization layer includes a second window region that is at least partially aligned with the first window region.