The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Jan. 09, 2012
Applicants:

Taiji Ogawa, Sakura, JP;

Hirohito Watanabe, Sakura, JP;

Masazaku Sato, Sakura, JP;

Inventors:

Taiji Ogawa, Sakura, JP;

Hirohito Watanabe, Sakura, JP;

Masazaku Sato, Sakura, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H01P 3/081 (2013.01); H05K 1/0225 (2013.01); H05K 1/0245 (2013.01); H05K 1/0253 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/09236 (2013.01);
Abstract

The printed wiring board has a conductor of signal lineand two conductive lineson one face of the first insulating layercovered by a second insulating layer, while having a ground layer of the groundpotential on the opposite face thereof, when the dielectric tangent A of the second insulating layer (insulating layer A)is larger than the dielectric tangent B of the first insulating layer (insulating layer B), Relational Expression 1: (relative permittivity B)·(width (W) of signal line(s))/(thickness (T) of first insulating layer (insulating layer B))>(relative permittivity A)·{(thickness (T) of signal line(s))/(distance (S) between signal line(s)and one conductive line)+(thickness (T) of signal line(s))/(distance (S) between signal line(s)and other conductive line)+(thickness (T) of signal lines)/(distance (S) between pair of signal lines (and)·2} is satisfied.


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