The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Feb. 25, 2008
Applicants:
Takao Nishimura, Kawasaki, JP;
Yoshiaki Narisawa, Aizuwakamatsu, JP;
Inventors:
Takao Nishimura, Kawasaki, JP;
Yoshiaki Narisawa, Aizuwakamatsu, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a semiconductor chip, a first semiconductor chipis provided on a chip-mounting component, and bonding wiresconnected to electrode padsE of the first semiconductor chipare fixed by being covered with a first insulating adhesive. A second semiconductor chipis mounted by being stacked on the first semiconductor chip, with the first insulating adhesivetherebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.