The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Nov. 17, 2011
Applicants:

Daisuke Uenda, Ibaraki, JP;

Takeshi Matsumura, Ibaraki, JP;

Koichi Inoue, Ibaraki, JP;

Miki Morita, Ibaraki, JP;

Inventors:

Daisuke Uenda, Ibaraki, JP;

Takeshi Matsumura, Ibaraki, JP;

Koichi Inoue, Ibaraki, JP;

Miki Morita, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/552 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 2224/81193 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); H01L 21/563 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13139 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/13111 (2013.01); H01L 2924/01037 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/831 (2013.01); H01L 2224/13116 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/83862 (2013.01); H01L 21/6836 (2013.01); H01L 2224/16225 (2013.01); H01L 23/544 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13113 (2013.01); H01L 2924/01055 (2013.01); H01L 2224/73204 (2013.01);
Abstract

An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.


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