The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Mar. 23, 2012
Koji Takemura, Osaka, JP;
Hiroshige Hirano, Nara, JP;
Yutaka Itoh, Kyoto, JP;
Hikari Sano, Hyogo, JP;
Koji Koike, Osaka, JP;
Koji Takemura, Osaka, JP;
Hiroshige Hirano, Nara, JP;
Yutaka Itoh, Kyoto, JP;
Hikari Sano, Hyogo, JP;
Koji Koike, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device includes: an interlayer insulating film formed on a substrate; a wiring formed in the interlayer insulating film in a chip region of the substrate; a seal ring formed in the interlayer insulating film in a periphery of the chip region and continuously surrounding the chip region; and a first protective film formed on the interlayer insulating film having the wiring and the seal ring formed therein. A first opening is formed in the first protective film in a region located outside the seal ring when viewed from the chip region, and the interlayer insulating film is exposed in the first opening.