The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Jan. 10, 2012
Applicants:

Seigo Oosawa, Nukata-gun, JP;

Shoji Mizuno, Okazaki, JP;

Yutaka Tomatsu, Okazaki, JP;

Inventors:

Seigo Oosawa, Nukata-gun, JP;

Shoji Mizuno, Okazaki, JP;

Yutaka Tomatsu, Okazaki, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 23/00 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/45 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 29/0615 (2013.01); H01L 29/1095 (2013.01); H01L 29/41741 (2013.01); H01L 29/0696 (2013.01); H01L 2224/04042 (2013.01); H01L 29/66734 (2013.01); H01L 29/456 (2013.01); H01L 29/402 (2013.01); H01L 2924/13055 (2013.01); H01L 2224/4911 (2013.01); H01L 2924/13091 (2013.01); H01L 29/41766 (2013.01); H01L 29/0634 (2013.01); H01L 24/49 (2013.01); H01L 29/66727 (2013.01); H01L 29/7813 (2013.01); H01L 29/7805 (2013.01); H01L 29/7811 (2013.01);
Abstract

A semiconductor device includes: a semiconductor substrate; an interlayer film on the substrate; a surface electrode on the interlayer film; a surface pad on the surface electrode; a backside electrode on the substrate; an element area including a cell portion having a vertical semiconductor element and a removal portion having multiple contact regions; and an outer periphery area. The surface electrode in the removal portion is electrically coupled with each contact region through a first contact hole in the interlayer film. The surface electrode in the cell portion is electrically coupled with the substrate through a second contact hole in the interlayer film. A part of the surface electrode in the removal portion facing each contact region is defined as a contact portion. The surface electrode includes multiple notches on a shortest distance line segment between each contact portion and the surface pad.


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