The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Feb. 04, 2011
Applicants:

Osamu Yoshioka, Tokyo, JP;

Hitoshi Motomura, Tokyo, JP;

Takehito Tsukamoto, Tokyo, JP;

Inventors:

Osamu Yoshioka, Tokyo, JP;

Hitoshi Motomura, Tokyo, JP;

Takehito Tsukamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 2224/48247 (2013.01); H01L 33/60 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 33/486 (2013.01); H01L 33/642 (2013.01); H01L 2924/01055 (2013.01); H01L 24/97 (2013.01); H01L 21/4828 (2013.01);
Abstract

A lead frame comprises on a same plane, a pad part including an LED chip mounting upper surface A on which at least an LED chip is to be mounted, and a lead part including an electric connection area C in which an electric connection with the LED chip is made. A relationship between an area Sof the mounting upper surface of the pad partand an area Sof a radiating lower surface opposite to the mounting upper surface is represented by 0<S<S. Side surfaces of the pad part between the mounting upper surface and the radiating lower surface are provided with stepped parts or tapered parts which spread in a direction from the mounting upper surface toward the radiating lower surface and hold a resin-filled during molding.


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