The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Aug. 02, 2011
Applicants:

Kengo Morioka, San Diego, CA (US);

Arne Knudsen, San Diego, CA (US);

Shingo Satou, Kirishima, JP;

Hidekazu Otomaru, Kagoshima, JP;

Andrew Thom, Maple Grove, MN (US);

Hiroshi Makino, Kirishima, JP;

Markus Reiterer, Plymouth, MN (US);

Gordon Munns, Stacy, MN (US);

Thomas Miltich, Ostego, MN (US);

Joyce Yamamoto, Maple Grove, MN (US);

Inventors:

Kengo Morioka, San Diego, CA (US);

Arne Knudsen, San Diego, CA (US);

Shingo Satou, Kirishima, JP;

Hidekazu Otomaru, Kagoshima, JP;

Andrew Thom, Maple Grove, MN (US);

Hiroshi Makino, Kirishima, JP;

Markus Reiterer, Plymouth, MN (US);

Gordon Munns, Stacy, MN (US);

Thomas Miltich, Ostego, MN (US);

Joyce Yamamoto, Maple Grove, MN (US);

Assignees:

Medtronic Inc., Minneapolis, MN (US);

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); C03B 29/00 (2006.01); A61L 33/02 (2006.01); A61N 1/375 (2006.01); C22C 32/00 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); C22C 32/0021 (2013.01);
Abstract

A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.


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