The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Feb. 24, 2012
Applicants:

Michael J. Pollack, Lansdale, PA (US);

Branson J. Darnell, Harleysville, PA (US);

Mary Ann Kessler, New Hope, PA (US);

William J. Zoll, Hatfield, PA (US);

Richard A. Didomizio, Hatfield, PA (US);

Inventors:

Michael J. Pollack, Lansdale, PA (US);

Branson J. Darnell, Harleysville, PA (US);

Mary Ann Kessler, New Hope, PA (US);

William J. Zoll, Hatfield, PA (US);

Richard A. DiDomizio, Hatfield, PA (US);

Assignee:

Pollack Laboratories, Inc., Colmar, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/18 (2006.01); H01M 2/26 (2006.01); H01M 2/08 (2006.01); H01R 4/70 (2006.01); H01R 43/24 (2006.01); H01M 2/22 (2006.01); H01R 43/20 (2006.01); H01R 13/405 (2006.01); H01M 2/30 (2006.01); H01M 2/06 (2006.01); G02B 6/42 (2006.01); H01M 10/052 (2010.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
H01R 4/70 (2013.01); G02B 6/4248 (2013.01); Y02E 60/12 (2013.01); H01R 43/24 (2013.01); H01M 2/22 (2013.01); H01R 43/20 (2013.01); H01R 13/405 (2013.01); H01M 2/30 (2013.01); H01M 10/052 (2013.01); H01M 2/06 (2013.01); H01R 13/521 (2013.01);
Abstract

A method of making a hermetically-sealed feed-through device includes inserting an elongate conductor or conductors within a hollow portion or portions of a plastic insulator body and inserting the plastic insulator body within a hollow outer jacket to form an assembly. At least one of the conductor or conductors, insulator body, or jacket of the assembly has a plurality of circumferential grooves. Thereafter, the assembly is crimped and/or is swage-crimped at ambient temperature to cause the materials of the conductor or conductors, insulator body, and outer jacket to be displaced or extrude into the grooves thereby creating mechanical interlocks between the conductor or conductors, insulator body, and outer jacket. Additional methods and feed-through devices made by the methods are also disclosed.


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