The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Aug. 24, 2012
Shih-long Wei, Hsinchu County, TW;
Shen-li Hsiao, Hsinchu County, TW;
Chien-hung Ho, Hsinchu County, TW;
Shih-Long Wei, Hsinchu County, TW;
Shen-Li Hsiao, Hsinchu County, TW;
Chien-Hung Ho, Hsinchu County, TW;
Viking Tech Corporation, Hsinchu County, TW;
Abstract
A method of making a package substrate includes steps of forming a plurality of trenches on a first surface of a metal plate, placing insulation material in the trenches, removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from substrate. The resulting substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material. The bonding layers on the opposite sides of the substrate are conducted by the conductive portion for heat dissipation, and are separated from one another by the insulation portion.