The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Sep. 16, 2011
Applicants:

Jae-choon Cho, Suwon-si, KR;

Myeong-ho Hong, Suwon-si, KR;

Hwa-young Lee, Suwon-si, KR;

Hee-sun Chun, Suwon-si, KR;

Choon-keun Lee, Suwon-si, KR;

Inventors:

Jae-Choon Cho, Suwon-si, KR;

Myeong-Ho Hong, Suwon-si, KR;

Hwa-Young Lee, Suwon-si, KR;

Hee-Sun Chun, Suwon-si, KR;

Choon-Keun Lee, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); B05D 3/10 (2006.01); C09K 21/14 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09K 21/14 (2013.01); H05K 1/0393 (2013.01); H05K 1/036 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0145 (2013.01); H05K 1/0326 (2013.01);
Abstract

The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.


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