The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Aug. 03, 2012
Applicants:

Bahman Hossini Soltani, Anjo, JP;

Hiroaki Mizuno, Kariya, JP;

Motohiro Ishibashi, Anjo, JP;

Osamu Nishikawa, Kariya, JP;

Sadamu Shiotsuki, Nishio, JP;

Kiyoshi Katoh, Anjo, JP;

Inventors:

Bahman Hossini Soltani, Anjo, JP;

Hiroaki Mizuno, Kariya, JP;

Motohiro Ishibashi, Anjo, JP;

Osamu Nishikawa, Kariya, JP;

Sadamu Shiotsuki, Nishio, JP;

Kiyoshi Katoh, Anjo, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 39/10 (2006.01); B29C 39/02 (2006.01);
U.S. Cl.
CPC ...
B29C 39/02 (2013.01); B29C 39/10 (2013.01);
Abstract

The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.


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